Semiconductor Fundamentals: Front-End Process
Published 3/2026
MP4 | Video: h264, 1920x1080 | Audio: AAC, 44.1 KHz, 2 Ch
Language: English | Duration: 6h 16m | Size: 3.8 GB
Master semiconductor physics, memory devices, and the complete front-to-back wafer fabrication and packaging process.
What you'll learn
Master the fundamentals of Semiconductor Physics, PN Junctions, Diodes, and Transistor operation principles.
Understand key unit processes including Photolithography, Plasma Etching, Deposition, and Metallization.
Learn about Wafer Preparation, Oxidation, Ion Implantation, CMP (Chemical Mechanical Polishing), and Cleaning.
Gain insights into Memory Devices, High-k/Low-k materials, Electrical Die Sorting (EDS), and Packaging...