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The company is aiming to build its own chip fab, Integrated circuit chips, and chip manufacturing plant to print its semiconductor designs without requiring U.S. equipment and components.
According to the source, Huawei will first begin with 45nm (nanometer) process technology that will be ready by the end of this year. Aside from 45nm, Huawei has also planned to build a 28nm manufacturing line.
Currently, Huawei’s semiconductor division – HiSilicon has the experience of chip designs but it cannot print those designs on wafers due to the restrictions on business with TSMC and it’s the only big challenge that Huawei need to face in order to make its own chipsets.
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